Overcoming chip shortages: low-cost open-source parametric 3-d printable solderless soic to dip breakout adapters

HIGHLIGHTS

• who: Cameron K. Brooks et al. from the Department of Electrical and Computer Engineering, Western University, London, ON N A , Canada have published the paper: Overcoming Chip Shortages: Low-Cost Open-Source Parametric 3-D Printable Solderless SOIC to DIP Breakout Adapters, in the Journal: Inventions 2023, 61 of /2023/
• what: Initially, the primary focus of supply chain disruptions was in the medical area . The approach is distinct from all of this previous work due to its simplicity and accessibility as it can be created using virtually any modern desktop fused filament fabrication (FFF) 3 . . .
  

   

  

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