HIGHLIGHTS
- who: Sandra Su00e6ther et al. from the Department of Structural Engineering, Faculty of Engineering, Norwegian University of Science and Technology (NTNU) have published the Article: Phonon thermal transport in copper: The effect of size, crystal orientation, and grain boundaries, in the Journal: (JOURNAL)
- what: The authors compare the results obtained from the rescale and Langevin thermostat procedures.
- how: As Evteev et_al claimed that the mean free path of copper phonons at 400 K is 4.6 nm and given that the thermal conductivity values obtained in this study are stable at lengths above . . .
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