HIGHLIGHTS
- who: Seonho Seok from the Center for Nanoscience and Nanotechnology (C N), University-Paris-Saclay, Palaiseau, France have published the research work: Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation, in the Journal: Micromachines 2021, 12, x 13 of 16 Figure 10. (a) Fracture parameters as function of top epoxy height. (b) Fracture parameters as function of bottom epoxy Figure 10. (a) Fracture parameters as function of top epoxy height. (b) Fracture parameters as function of bottom epoxy height. height. of /2021/
- what: As the objective of this simulationfor is . . .
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