Process and mechanism of sealing 65 vol.% sicp/zl102 composite and dm305 electronic glass with borosilicate glass

HIGHLIGHTS

• who: Da Zhou et al. from the School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo, China have published the research: Process and Mechanism of Sealing 65 vol.% SiCp/ZL102 Composite and DM305 Electronic Glass with Borosilicate Glass, in the Journal: Metals 2023, 13, x FOR PEER REVIEW of /2023/
• how: In this work the lead-free SiO2 -B2 O3 -Na2 O glass filler was used to seal 65 vol.% composites and electronic glass in an atmospheric environment. The results showed that the glass filler and base material were connected through a dual mechanism . . .
  

   

  

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