HIGHLIGHTS
- who: Kunal Mishra and Raman P. Singh from the Corning Incorporated, Painted Post, NY, USA School of Material Science and Engineering, Oklahoma State University, Tulsa, OK, USA have published the research: R-Curve Behavior of Polyhedral Oligomeric Silsesquioxane (POSS)-Epoxy Nanocomposites, in the Journal: (JOURNAL)
- what: This study focuses on the use of the J-integral concept to quantify the initiation toughness and characterize the crack growth resistance curve.
- how: To keep the specimen preparation constant in this study the authors have used multiple specimen methods to quantify the resistance against the stable . . .
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