Robust packaging of vertically aligned graphite substrate by copper micro-rib structuring

HIGHLIGHTS

• who: Tatsuhiko Aizawa and collaborators from the Surface Engineering Design Laboratory, Shibaura Institute of Technology, Tokyo, Japan have published the article: Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring, in the Journal: C 2022, 8, x FOR PEER REVIEW C 2022, 8, x FOR PEER REVIEW of /2022/
• what: The rib-structured VGS-copper package was proposed to preserve mechanical integrity with robustness against thermal transient loading.
• how: Different from the brazing method the copper deposition advanced in the ionized This copper wet-plating method After chemically polishing and . . .
  

   

  

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