Room-temperature direct cu semi-additive plating (sap) bonding for chip-on-wafer 3d heterogenous integration with μled

HIGHLIGHTS

• who: - heterogeneous integration et al. from the (UNIVERSITY) have published the research: Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration with u03bcLED, in the Journal: (JOURNAL)
• what: In this letter, the authors demonstrate room-temperature u00b5LED array stacking in a dielet-on-wafer/3D-IC configuration using SAP bonding. The main reason for the other non-emission u00b5LEDs is discussed.
• how: The bottom of Fig 3(a) shows the interconnect yield of the u00b5LEDs bonded under current conditions used in this study where three key . . .
  

   

  

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