Selection of semiconductor packaging materials by combined fuzzy ahp-entropy and proximity index value method

HIGHLIGHTS

• who: Fuzzy AHP-Entropy and colleagues from the Department of Mechanical Engineering, Dicle Universitesi, Diyarbakir, Turkey have published the Article: Selection of Semiconductor Packaging Materials by Combined Fuzzy AHP-Entropy and Proximity Index Value Method, in the Journal: Mathematical Problems in Engineering of 31/Dec/2022
• what: Te residue of no-clean fux (NCF) on the printed circuit board assembly has been one of the major reasons for corrosion reliability failure of electronic devices. In this study thirty-one carboxylic acids (mono di tri and hydroxyl) were ranked based on the six diferent criteria i . . .
  

   

  

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