Stress and temperature constrained thermoelastic topology optimization of support structures for additive manufacturing

HIGHLIGHTS

• What: Based on the SIMP method, a multi-constraint topology optimization model considering AM layer-bylayer printing of thermoelastic components is established to satisfy the requirement of optimized design of the support structure to achieve the printing of multi-physical field coupling.
• Who: Chongwei Zhou and colleagues from the Qingdao University Center for Intelligent Electrical Vehicle Power System, Qingdao, China have published the article: Stress and temperature constrained thermoelastic topology optimization of support structures for additive manufacturing, in the Journal: (JOURNAL)
• How: This paper presents a thermoelastic topology optimization formulation for the design . . .
  

   

  

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