Studies on the mechanical models and behaviors for the stamp/film interface in microtransfer printing

HIGHLIGHTS

• who: Mengjie Wu et al. from the College of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing, China have published the Article: Studies on the Mechanical Models and Behaviors for the Stamp/Film Interface in Microtransfer Printing, in the Journal: Materials 2022, 5915 of /2022/
• what: To analyze the interface adhesion/delamination problem CZM with the finite element method, cohesive elements with proper traction-separation law should be preset along the interface, as show addition, the model shown in Figure 5b, which introduces initial crack both ends of the interface through inserting cohesive elements only . . .
  

   

  

  If you want to have access to all the content you need to log in!

  Thanks :)

  Username or E-mail:

  If you don't have an account, you can create one here.