HIGHLIGHTS
SUMMARY
A. Mallik, et_al studied the effect of temperature and cavitation in the process of copper deposition, and found that the grain structure at low temperature is cleaner, finer and more regular than that at room temperature. When the temperature decreases to near the freezing point of an electrolyte, few reports have evaluated the influence of temperature change on the deposition performance of the copper layer, especially the nucleation and growth process of copper electrodeposition. Between the two peaks, the deposited copper layer at a temperature of ±3 ◦ C has good comprehensive mechanical properties, which . . .
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