Substrateless packaging for a d-band mmic based on a waveguide with a glide-symmetric ebg hole configuration

HIGHLIGHTS

• who: Weihua Yu and collaborators from the Beijing Key Laboratory of Millimeter-Wave and Terahertz Wave Technology, School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing, China Chalmers University of Technology, Gothenburg, Sweden have published the research: Substrateless Packaging for a D-Band MMIC Based on a Waveguide with a Glide-Symmetric EBG Hole Configuration, in the Journal: Sensors 2022, 22, x FOR PEER REVIEW Sensors 2022, 22, x FOR PEER REVIEW of /2022/
• what: A Conversion GWG based on(CL) a glide-symmetric EBG hole configuration hasmodules. the advantages of inFigure 19 . . .
  

   

  

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