The interplay of crack hopping, delamination and interface failure in drying nanoparticle films

HIGHLIGHTS

• who: Bin Yang from the SchoolUniversity of have published the paper: The interplay of crack hopping, delamination and interface failure in drying nanoparticle films, in the Journal: Scientific Reports Scientific Reports
• what: In the experiments described here it was observed that hopping cracks almost invariably finish their movement on a shear band. A key difference being that the model discussed above neglects the role of adhesion - a factor that is considered in more detail by Faou et_al25. The experiments demonstrate the important links between shear banding, crack propagation and delamination in drying colloidal films.
 



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