Thermal analysis and junction temperature estimation under different ambient temperatures considering convection thermal coupling between power devices

HIGHLIGHTS

  • who: Kaixin Wei and collaborators from the School of Automobile and Transportation, Tianjin University of Technology and Education, Dagu South State Key Laboratory of Engines, Tianjin University, Ya Guan Road, Jinnan District, Tianjin, China have published the paper: Thermal Analysis and Junction Temperature Estimation under Different Ambient Temperatures Considering Convection Thermal Coupling between Power Devices, in the Journal: (JOURNAL)
  • how: The calculation formula of junction temperature is derived which considers the conduction thermal coupling effect while the derivation is based on a fixed ambient temperature and the analysis is based on the ideal air region . . .

     

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