HIGHLIGHTS
- who: Ultimately-Thinned-and-Transfer-Bonded and collaborators from the Institut d'Electronique, de Microélectronique et de Nanotechnologie, UMR, Villeneuve-d'Ascq, France have published the article: Thermal Analysis of Ultimately-Thinned-and-Transfer-Bonded CMOS on Mechanically Flexible Foils, in the Journal: (JOURNAL)
- what: In this letter the authors report the analysis of chips (UTTB) onto polyimide copper substrates. The first step of analysis focuses on the thermal behavior according to the nature of the host substrate. This work shows that UTTB performed on a thin Cu substrate is effective in maintaining heat . . .
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