HIGHLIGHTS
- who: Jiarui Zhu and colleagues from the State Key Laboratory of Nonferrous Metals and Processes, GRINM Group Co, Ltd, Beijing, China have published the article: Thermal Conductance of Copper-Graphene Interface: A Molecular Simulation, in the Journal: Materials 2022, 7588 of /2022/
- how: The calculation results are shown in Figure 5.
SUMMARY
Electronic devices are increasingly becoming more integrated, multi-functional, and smaller as a result of the rapid development of the electronics industry. Chu et_al enabled the in-plane thermal conductivity of graphene/copper composites to reach 525 W/mK . . .
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