Thermal fatigue failure of micro-solder joints in electronic packaging devices: a review

HIGHLIGHTS

• What: Thermal failure is one of the main reasons for failure . For high-power electronic devices with large pad structures, factors such as temFor high-power electronic devices with large pad structures, factors such as temperperature, vibration, and humidity are the main reasons for their failure, among which ature, vibration, and humidity are the main reasons for their failure, among which temtemperature accounts for the main part of the total failure of power devices .
• Who: Lei Li et al. from the School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan, China have published the paper: Thermal . . .
  

   

  

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