HIGHLIGHTS
- who: Xin Wang and colleagues from the Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing, China have published the research work: Thermal Insulation and Compressive Performances of 3D Printing Flexible Load-Bearing and Thermal Insulation Integrated Lattice, in the Journal: Materials 2022, 8625 of /2022/
- what: In this work the with a big width-thickness ratio which empowered the flexibility of the by reducing the rod deformation during compression was proposed. This work provides a new way of designing and and achieves the functionality preservation of and after . . .
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