Thermal performance and geometric optimization of fractal t-shaped highly-conductive material for cooling of a rectangular chip

HIGHLIGHTS

• who: Rongsheng Zhu and Dalei Jing from the School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai, China have published the research work: Thermal Performance and Geometric Optimization of Fractal T-Shaped Highly-Conductive Material for Cooling of a Rectangular Chip, in the Journal: (JOURNAL) of 27/Nov/2022
• what: The main reason is that the heat exchange area will also increase with the increase of V, which further promotes heat dissipation performance and reduces the maximum temperature of the chip.
• how: The schematic of a simulation model applied in . . .
  

   

  

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