HIGHLIGHTS
- who: Tingting Lian from the Author details , Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, China China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, China. The, th Research Institute of China Electronics Technology Group Corporation, Chengdu, China. Chengdu HiWafer Semiconductor Co [, ]. Ltd., Chengdu, China have published the article: Thermal property evaluation of a 2.5D integration method with device level microchannel direct cooling for a high-power GaN HEMT device, in the Journal: (JOURNAL)
- what: This work shows the cooling capacity of microchannels; however, there is no further information about methods to . . .
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