Through-silicon via device non-destructive defect evaluation using ultra-high-resolution acoustic microscopy system

HIGHLIGHTS

• who: Tae Hyeong Kim et al. from the Graduate School of Energy and Environment, Seoul National University of Science and Technology, Gongneung-ro, Nowon-gu, Seoul, Republic of Korea have published the paper: Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System, in the Journal: Materials 2023, 16, x FOR PEER REVIEW of /2023/
• what: In this study, an acoustic microscopy system that can use high frequencies was developed to overcome the limited resolution of the existing ultrasonic technique.
• how: In this study a B (boron)-doped . . .
  

   

  

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