Towards robust thermal mems: demonstration of a novel approach for solid thermal isolation by substrate-level integrated porous microstructures

HIGHLIGHTS

• who: Ole Behrmann and colleagues from the (UNIVERSITY) have published the research work: Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures, in the Journal: Micromachines 2022, 1178 of /2022/
• what: As the geometry factor GPor and the combined constant K cannot be found analytically for a complex 3D geometry such as the one used in this work, they are determined by the finite element method. For this, models representing the sensor on both a thin-film membrane within a silicon frame and directly on . . .
  

   

  

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