Uv-nanoimprint and deep reactive ion etching of high efficiency silicon metalenses: high throughput at low cost with excellent resolution and repeatability

HIGHLIGHTS

• who: Christopher A. Dirdal and collaborators from the National Institute of Materials Physics, Atomistilor, Magurele have published the research work: UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability, in the Journal: Nanomaterials 2023, 436 of /2023/
• what: The authors demonstrate the use of Lithography and Ion Etching (Bosch and Cryogenic) towards this goal. The authors demonstrate process which removes the characteristic sidewall surface roughness of the Bosch process allowing for smooth 90-degree vertical sidewalls. This work has demonstrated metasurface structures . . .
  

   

  

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