HIGHLIGHTS
- who: Kai Duan from the The device molds were fabricated using , photolithography methodsBriefly, an , (Microchem) was spin-coated on a silicon wafer (University Wafer) to yield a , u00b5m thick layer, soft baked and exposed to UV light through a mask. After the postexposure bake, it was finally developed with an , developer. The thickness of the channel for the gradient layer was measured using a surface profilometer. The surface of the wafer was plasma treated and then left in a vacuum overnight for salinization with trichloro ( H, H, H, perfluorooctyl). To enable hydrogel bonding on top of the . . .
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