Emerging mos2 wafer-scale technique for integrated circuits

HIGHLIGHTS

• who: Zimeng Ye from the College of Materials Science and Engineering, Sichuan University, Chengdu, Peopleu2019s Republic of China have published the research: Emerging MoS2 Wafer-Scale Technique for Integrated Circuits, in the Journal: (JOURNAL)
• what: The acquisition of low defect-density and continuous film has gradually become a research focus in 2D materials.
• how: Cheng et_al pre-treated u00adSiO2/Si substrate with plasma and the results showed that the treated rough area effectively reduced nucleation density and increased film growth rate . The results showed that the side length of triangular u00adMoS2 with PTASassisted . . .
  

   

  

  If you want to have access to all the content you need to log in!

  Thanks :)

  Username or Email

  Password

  Remember me

  Lost your password?

  If you don't have an account, you can create one here.