HIGHLIGHTS
- who: Ho Kok Hoe et al. from the (UNIVERSITY) have published the research: An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study, in the Journal: (JOURNAL)
- what: The paper aims to develop and validate an integrated model to recover the throughput shortage through adjustment of process parameters in a semiconductor assembly setting.
- how: The case study was carried out in a semiconductor assembly line which consisted of three die attach machines four oven cure machines nine wire bond machines and three pre-cap inspection . . .
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